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Hoodline
hoodline.com > 2026 > 04 > union-city-shocks-silicon-valley-snags-first-u-s-ai-chip-packaging-hub

Union City Shocks Silicon Valley, Snags First U.S. AI Chip Packaging Hub

4+ mon, 2+ week ago   (163+ words) Union City just scored a serious upgrade in the tech world. Japanese materials firm Resonac has opened what industry and company announcements describe as the first U.S. research center dedicated to advanced semiconductor packaging, planting a key piece of the AI…...

Google News
hoodline.com > 2026 > 04 > meta-s-multi-gigawatt-ai-power-play-with-broadcom-supercharges-silicon-valley

Google News

4+ mon, 3+ week ago   (984+ words) Meta and Broadcom announced a multiyear deal to co-develop MTIA AI accelerators, starting with an initial 1GW deployment and plans to scale to multiple gigawatts. Meta and Broadcom are cranking their AI relationship up several notches, unveiling an expanded, multiyear deal…...